MILO Power/MCU Board Layout

Learning Objectives

With the sensor board layout finished and reviewed, we'll lay out the MCU and power board. We've got fewer constraints on these boards, so it'll be a little bit easier.

All of the same wisdom from before applies, and your board should have:

• Bypass capacitors placed close to the power pins they bypass.
• Mouting holes, sized for a M3 screw.
• A label on the silkscreen, with similar information as last time.
• A ground plane on the back of the board.
• Tidy component placement, and clean routing to match.
• An acceptable set of DRC errors - you'll still have some, but they should be things that don't matter.

The only specifics are:

• The power board should be 2.5" x 1.5" (width x height).
• For the power board, use 20 mil traces for the VBAT, 5V (USB), and 3.3V nets. This is to increase the current-carrying capability of these traces.
• The MCU board should be 1.5" x 2" (width x height). Again, this is to help us panelize boards when we send them out to the fab.

When you're done with the above and your design is saved in A365, go ahead and click submit down below. We'll review your boards asynchronously, leave comments on them in the Altium workspace, and then review them collectively, much like we did for shcematic reviews in lab01.

Click submit when you're finished. Put your best joke in the box.

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